Soft Punch Through (SPT) – Setting new Standards in 1200V IGBT

The industrial drives market continues to show dynamic growth and tough competition. The players in this market use all their ingenuity in order to find competitive advantage wherever possible. Part of this competitive advantage comes from close interaction with their suppliers: of passive components, mechanics, control electronics and, of course, IGBT modules. When searching for competitive advantage the IGBT can be decisive, because a number of its characteristics define the critical parameters for the system design. This paper introduces a new 1200V IGBT from ABB Semiconductors: the Soft Punch Through (SPT). This line-up of dies is used in the LoPak module range. The new chipset demonstrates ruggedness, low-losses, good parallelabilty and soft switching edges. In addition the chip layout has been carefully designed to allow very efficient and simple module construction without the need for internal chip paralleling resistors, with a very large bondable area and corner gate.